APAC Innovation Summit 2014

Shaping The Future

To mark the 10th anniversary of InnoAsia — the signature event of Hong Kong Scienceand Technology Parks Corporation — it has been renamed as the APAC Innovation Summit (AIS) with “Shaping the Future” as the theme.With the support of Hong Kong’s universities, R&D centres and over 70 trade associations, AIS aims to create a landmark forum where leading minds and influencers from Asian Pacific nations can converge to mutually inspire through new thinking models and engage in forward-thinking dialogue on policy implementation and market adaption with uniquely Asian characteristics. 

Theme:    Shaping the Future

Date:                     1- 6 Dec 2014 (Mon – Sat)

Time:                   9am-6pm

Venue:                 Hong Kong Convention and Exhibition Centre

Organiser:         Hong Kong Science and Technology Parks Corporation

Website:           http://www.apacinnosummit.net/

Email:                [email protected]

 

Special package for members of Supporting Organisations (Note: Our organization HKYEW):

20% discount for members

(Register before 15 November 2014 to enjoy an additional 20% discount on top of the 15% early bird discount)

 

 

「亞太創新峰會2014」

創新締造未來

為慶祝香港科技園公司每年一度的盛事「創新科技亞洲會議」邁入第十年，本屆活動將重新命名為「亞太創新峰會」，以「創新締造未來」為主題，規模更勝歷屆。「亞太創新峰會」已邀請香港大專院校、研發中心及超過70個商會贊助與支持，旨在開創一個具標誌性的論壇，讓來自亞太國家的業界領袖及翹楚互相交流創新思維，並就政策實施及市場應變等議題展開獨具亞洲特色的深入討論。

 

主題:              創新締造未來
日期:              2014年12月1-6日 (星期一至六)

時間:              上午9時至下午6時           
地點:               香港會議展覽中心
主辦單位:      香港科技園公司

網頁:                  http://www.apacinnosummit.net/

電郵:                  [email protected]

 

支持機構會員(註: 本會「青年創業軍」)報名優惠:

凡支持機構之會員可享8折優惠

(於11月15日前報名，可享85折提早報名優惠，支持機構之會員可額外享8折優惠)